high-bandwidth memory
High-bandwidth memory is a memory standard that stacks DRAM chips in layers to provide a very wide data path.
High-bandwidth memory, usually called HBM, stacks multiple DRAM dies vertically, connects them with through-silicon vias and places the stack right next to the processor. The standard is defined by JEDEC, the semiconductor standards body.
HBM is used mainly in chips that must move large amounts of data quickly, such as GPUs and AI accelerators, which has made it a key component of hardware for AI training and inference. SK hynix, Samsung and Micron are its main producers.
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Rising demand for AI chips has raised concerns that supplies of high-bandwidth memory (HBM), the fast memory stacked next to AI processors, along with power con…